Ovenless Burn-In & HTOL solution

3D Model


自主控制待测器件加热器,最大限度地降低能耗

The Microtest Ovenless Burn-In is a powerful and innovative solution for Burn-in, that allows the maximum flexibility to match your needs.

Reasons Why

The only ovenless Burn-In solution on the market
A much greener solution compared to traditional ovens
Noticeable ESG impact when implemented – power, footprint, cooling
Faster thermal ramp up and cool down, with better per - DUT temperature control
Fully automated, SECS GEM and factory 4.0 compliant

Product Presentation

The Ovenless Burn‑In & HTOL Solution from Microtest offers a groundbreaking, eco-friendly alternative to traditional burn-in ovens. Designed for high-density device testing, it delivers per‑DUT independent thermal control without ovens, dramatically reducing energy usage, cooling requirements, and facility footprint.
This rack-based platform includes a Burn-In System (BIS) and racks with 24 internal slots, each slot accommodating up to 120 devices—enabling fully automated, large-scale burn-in and HTOL cycles. The system achieves faster temperature ramp-up/cool-down and precise thermal regulation at the DUT level—significantly improving test efficiency and uniformity.
Its green credentials are impressive, with lower power consumption and a reduced carbon footprint, aligning with ESG and Industry 4.0 initiatives.
Measuring approximately 2000 mm (H) × 1200 mm (W) × 1300 mm (D), this solution is SECS‑GEM compliant and cleanroom-ready, easily integrating into existing production lines. Its versatile application spans across sectors—from automotive, medical, MEMS and consumer electronics to aerospace, defence, industrial, and power semiconductors.
In summary, the Ovenless Burn‑In & HTOL Solution combines cutting-edge thermal management, sustainable operation, and high-throughput automation—providing manufacturers with a smarter, cleaner, and more efficient platform for reliability testing of semiconductor devices.

FEATURES

60 sites double Vcore

Number of test sites
1440

Dimensions

Depth
1300 mm
Width
1200 mm
Height
2000 mm

Analog/Power

VCORE1 SUPPLY
2x site (fully independent)
@0.6-3.6V
VCORE2 SUPPLY
2x site (each channel shared on 5 sites)
@0.6-3.6V
VIO SUPPLY
1x site (each channel shared on 10 sites)
@1.65 – 5.5 V

Digital

Digital Channels
10x site (4 DRIVERS, 2 RECEIVERS, 4 BIDIRECTIONALS)
Shared Digital Channels
15 DRIVERS x site (each channel shared on 5 site)

Measurements Instruments

Diode Measure
60
Heater Controls
60
Heater Resistance Measure
60
Voltage Measure
60

Burn In Datasheet

应用领域

More info

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